VIA Unveils First Pico-ITXe Board with Stackable I/O Expansion
VIA EPIA-P710 utilizes new SUMIT connectors for the modular addition of advanced serial connectivity including PCI Express, offering developers more flexible and cost effective design options for compact embedded systems.



“You really need to develop a whole product solution—hardware, software, UI, interfaces, and process redesign—with a consideration for what problem you are really trying to solve.” —Aldo Zini
What obstacles remain for robots to work alongside humans in industrial settings, and how far have we come in eliminating those challenges? Dr. Roland Menassa answers these and other questions in his presentation at the RoboBusiness summit November 2-3 in Boston.
John Reid, director of Product Technology and Innovation at Moline Technology Innovation Center, a part of John Deere’s Global Technology Innovation Network, discusses how his company’s technologies will help feed the world’s billions.
