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Service and Healthcare
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Rockwell Collins Successfully Demonstrates Autonomous Vehicle
By Robotics Trends Staff - Filed Feb 15, 2006
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Rockwell Collins and teammates Oshkosh Truck Corporation and the University of Parma, have successfully demonstrated their Intelligent Vehicle Management System (iVMS) on an Oshkosh® Palletized Loading System (PLS) heavy logistics vehicle.

The test was conducted on January 23 and 24 at the Yuma Proving Grounds, Ariz. The team demonstrated how technology developed for the Defense Advanced Research Project Administration’s (DARPA) Grand Challenge could be transferred onto a different vehicle platform in a six-week time period. Rockwell Collins, Oshkosh Truck and the University of Parma successfully completed the 132-mile DARPA Grand Challenge race in October 2005.

The technology, utilized on the Oshkosh TerraMax™ vehicle for the Grand Challenge, was transferred to the PLS vehicle, which ran seven 3-mile loops, both loaded and unloaded, through a Yuma Proving Grounds desert course, with no human input. Various U.S. Army and Marine personnel either viewed the demonstration or rode on the PLS.

“This is the first demonstration of a fully autonomous heavy logistics vehicle for the U.S. Department of Defense,” said Woody Hogle, vice president and general manager of Integrated Systems for Rockwell Collins. “The demonstration proved that the system can be integrated onto various platforms in an accelerated manner while preserving the load carrying capabilities of the vehicle.”

Hogle added, “Autonomous navigation gives Army commanders options on how to best deploy their convoy personnel.”

Rockwell Collins (NYSE: COL) is a worldwide leader in the design, production, and support of communication and aviation electronics for commercial and government customers. The company’s 17,000 employees in 27 countries deliver industry-leading communication, navigation, surveillance, display, flight control, in-flight entertainment, information management, and maintenance, training and simulation solutions. Additional information is available at

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